Semiconductor device and manufacturing method thereof

Details Semiconductor device and manufacturing method thereof Semiconductor device and manufacturing method thereof

1995-12-21

1997-11-11

Picardat, Kevin

Fishing, trapping, and vermin destroying

437187, 437203, 437209, H01L 2144

Patent

active

056863535

ABSTRACT:
An electrode terminal (5) provided on a surface of a semiconductor chip (4) has a square shape in plane view. Further, the projecting apex portion (8a) of a bump (8) provided on the electrode terminal (5) orients to a corner portion (5a) of the electrode terminal (5). Hereupon, a gold ball (2a) formed by melting the lower end portion of a gold wire (2) supplied through a capillary (1) is joined to the electrode terminal (5), and then the capillary (1) is moved in the direction of a diagonal line of the square electrode (5). Thus, the main portion of the gold wire (2) is separated from the gold ball (2a) so that the bump (8) is formed.

REFERENCES:
patent: 4784972 (1988-11-01), Hatada
patent: 5014111 (1991-05-01), Tsuda et al.
patent: 5071787 (1991-12-01), Mori et al.
patent: 5124277 (1992-06-01), Tsumura
patent: 5289631 (1994-03-01), Koopman et al.
patent: 5306664 (1994-04-01), Sakura
patent: 5510758 (1996-04-01), Fujita et al.
patent: 5514912 (1996-05-01), Ogashiwa

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