Semiconductor device and manufacturing method thereof

Details Semiconductor device and manufacturing method thereof Semiconductor device and manufacturing method thereof

2011-04-12

2011-04-12

Dang, Trung (Department: 2892)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Subsequent separation into plural bodies

C438S685000, C257SE21568

Reexamination Certificate

active

07923348

ABSTRACT:
It is an object of the present invention to provide a peeling method that causes no damage to a layer to be peeled and to allow not only a layer to be peeled with a small surface area but also a layer to be peeled with a large surface area to be peeled entirely. Further, it is also an object of the present invention to bond a layer to be peeled to various base materials to provide a lighter semiconductor device and a manufacturing method thereof. Particularly, it is an object to bond various elements typified by a TFF, (a thin film diode, a photoelectric conversion element comprising a PIN junction of silicon, or a silicon resistance element) to a flexible film to provide a lighter semiconductor device and a manufacturing method thereof.

REFERENCES:
patent: 4722765 (1988-02-01), Ambros et al.
patent: 5206749 (1993-04-01), Zavracky et al.
patent: 5258325 (1993-11-01), Spitzer et al.
patent: 5317236 (1994-05-01), Zavracky et al.
patent: 5341015 (1994-08-01), Kohno
patent: 5376561 (1994-12-01), Vu et al.
patent: 5397713 (1995-03-01), Hamamoto et al.
patent: 5654811 (1997-08-01), Spitzer et al.
patent: 5674304 (1997-10-01), Fukada et al.
patent: 5757456 (1998-05-01), Yamazaki et al.
patent: 5781164 (1998-07-01), Jacobsen et al.
patent: 5807440 (1998-09-01), Kubota et al.
patent: 5821138 (1998-10-01), Yamazaki et al.
patent: 5851862 (1998-12-01), Ohtani et al.
patent: 5879741 (1999-03-01), Itoh
patent: 5929961 (1999-07-01), Nishi et al.
patent: 5946551 (1999-08-01), Dimitrakopoulos et al.
patent: 5981970 (1999-11-01), Dimitrakopoulos et al.
patent: 6033974 (2000-03-01), Henley et al.
patent: 6043800 (2000-03-01), Spitzer et al.
patent: 6059913 (2000-05-01), Asmussen et al.
patent: 6100166 (2000-08-01), Sakaguchi et al.
patent: 6118502 (2000-09-01), Yamazaki et al.
patent: 6127199 (2000-10-01), Inoue et al.
patent: 6210479 (2001-04-01), Bojarczuk et al.
patent: 6221738 (2001-04-01), Sakaguchi et al.
patent: 6261634 (2001-07-01), Itoh
patent: 6268695 (2001-07-01), Affinito
patent: 6310362 (2001-10-01), Takemura
patent: 6320640 (2001-11-01), Nishi et al.
patent: 6339010 (2002-01-01), Sameshima
patent: 6344660 (2002-02-01), Dimitrakopoulos et al.
patent: 6344662 (2002-02-01), Dimitrakopoulos et al.
patent: 6362866 (2002-03-01), Yamazaki et al.
patent: 6372608 (2002-04-01), Shimoda et al.
patent: 6376333 (2002-04-01), Yamazaki et al.
patent: 6391220 (2002-05-01), Zhang et al.
patent: 6423614 (2002-07-01), Doyle
patent: 6426264 (2002-07-01), Kawai
patent: 6448152 (2002-09-01), Henley et al.
patent: 6486041 (2002-11-01), Henley et al.
patent: 6492026 (2002-12-01), Graff et al.
patent: 6521511 (2003-02-01), Inoue et al.
patent: 6544430 (2003-04-01), McCormack et al.
patent: 6572780 (2003-06-01), McCormack et al.
patent: 6632708 (2003-10-01), Sakama et al.
patent: 6645830 (2003-11-01), Shimoda et al.
patent: 6664169 (2003-12-01), Iwasaki et al.
patent: 6682990 (2004-01-01), Iwane et al.
patent: RE38466 (2004-03-01), Inoue et al.
patent: 6700631 (2004-03-01), Inoue et al.
patent: 6737285 (2004-05-01), Iketani et al.
patent: 6750481 (2004-06-01), Kawai
patent: 6753212 (2004-06-01), Yamazaki et al.
patent: 6774010 (2004-08-01), Chu et al.
patent: 6781152 (2004-08-01), Yamazaki
patent: 6784113 (2004-08-01), Hembree
patent: 6790747 (2004-09-01), Henley et al.
patent: 6802926 (2004-10-01), Mizutani et al.
patent: 6814832 (2004-11-01), Utsunomiya
patent: 6815240 (2004-11-01), Hayashi
patent: 6818530 (2004-11-01), Shimoda et al.
patent: 6875671 (2005-04-01), Faris
patent: 6885389 (2005-04-01), Inoue et al.
patent: 6943369 (2005-09-01), Hayashi
patent: 6946361 (2005-09-01), Takayama et al.
patent: 6974731 (2005-12-01), Yamazaki et al.
patent: 6998282 (2006-02-01), Yamazaki et al.
patent: 7045438 (2006-05-01), Yamazaki et al.
patent: 7060153 (2006-06-01), Yamazaki et al.
patent: 7094665 (2006-08-01), Shimoda et al.
patent: 7119364 (2006-10-01), Yamazaki
patent: 7122445 (2006-10-01), Takayama et al.
patent: 7189631 (2007-03-01), Yamazaki et al.
patent: 7221338 (2007-05-01), Yamazaki et al.
patent: 7332381 (2008-02-01), Maruyama et al.
patent: 7335573 (2008-02-01), Takayama et al.
patent: 7351300 (2008-04-01), Takayama et al.
patent: 7361519 (2008-04-01), Yamazaki et al.
patent: 7375782 (2008-05-01), Yamazaki et al.
patent: 7425931 (2008-09-01), Yamazaki et al.
patent: 7547612 (2009-06-01), Yamazaki et al.
patent: 7862677 (2011-01-01), Nakajima et al.
patent: 2003/0032210 (2003-02-01), Takayama et al.
patent: 2008/0309585 (2008-12-01), Yamazaki et al.
patent: 1256794 (2000-06-01), None
patent: 1312590 (2001-09-01), None
patent: 1332471 (2002-01-01), None
patent: 0 858 110 (1998-08-01), None
patent: 1 014 452 (2000-06-01), None
patent: 1 122794 (2001-08-01), None
patent: 1 351 308 (2003-10-01), None
patent: 05-347186 (1993-12-01), None
patent: 08-288522 (1996-11-01), None
patent: 10-125929 (1998-05-01), None
patent: 10-125930 (1998-05-01), None
patent: 10-125931 (1998-05-01), None
patent: 11-097357 (1999-04-01), None
patent: 2001-085154 (2001-03-01), None
patent: 2001-189460 (2001-07-01), None
patent: 2001-267578 (2001-09-01), None
patent: 2001-272923 (2001-10-01), None
patent: 3238223 (2001-12-01), None
patent: 2002-033464 (2002-01-01), None
patent: 2002-184959 (2002-06-01), None
patent: 2002-328624 (2002-11-01), None
patent: 2003-142666 (2003-05-01), None
patent: 1993-0015211 (1993-07-01), None
patent: 2001-0086116 (2001-09-01), None
patent: 478180 (2002-03-01), None
patent: 487967 (2002-05-01), None
patent: WO 92/12453 (1992-07-01), None
patent: WO 99/44242 (1999-09-01), None
patent: WO-00/38247 (2000-06-01), None
T. Takayama et al.,A CPU on a Plastic Film Substrate, 2004 Symposium on VLSI Technology, Digest of Technical Papers, Jun. 15-17, 2004, pp. 230-231.
Office Action (Application No. 92130091) dated Mar. 9, 2009.
Korean Office Action (Application No. 2005-7006398) Dated Aug. 23, 2010.

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