Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2006-12-26
2006-12-26
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S710000, C257S924000, C257S723000, C257SE23190, C257SE23145, C257SE23145, C257S023000, C257SE23193
Reexamination Certificate
active
07154173
ABSTRACT:
This invention miniaturizes a package of a semiconductor device and simplifies a manufacturing procedure to reduce a manufacturing cost. A semiconductor wafer formed of a plurality of semiconductor chips formed with MEMS devices and wiring thereof on front surface thereof and a cap arrayed wafer disposed with a plurality of sealing caps are attached to seal the MEMS devices in cavities between them. Then, a plurality of via-holes is provided penetrating through the semiconductor wafer to form embedded electrodes therein, and bump electrodes are formed thereon. After this procedure, this structure is cut along scribe lines to be divided into each of packages.
REFERENCES:
patent: 4486622 (1984-12-01), Maselli et al.
patent: 5949073 (1999-09-01), Shimoyama
patent: 6630725 (2003-10-01), Kuo et al.
patent: 6633079 (2003-10-01), Cheever et al.
patent: 6647778 (2003-11-01), Sparks
patent: 6809412 (2004-10-01), Tourino et al.
patent: 6852926 (2005-02-01), Ma et al.
patent: 6984421 (2006-01-01), Pahl et al.
patent: 2002/0113296 (2002-08-01), Cho et al.
patent: 2003/0042587 (2003-03-01), Lee
patent: 2003/0080434 (2003-05-01), Wataya
patent: 2005/0146632 (2005-07-01), Wataya
patent: 1401136 (2003-03-01), None
patent: 1463911 (2003-12-01), None
patent: 58-153354 (1983-09-01), None
patent: 62-248242 (1987-10-01), None
patent: 2-267935 (1990-11-01), None
patent: 7-201731 (1995-08-01), None
patent: 11-258055 (1999-09-01), None
patent: 11-351959 (1999-12-01), None
patent: 2001-013156 (2001-01-01), None
patent: 2003-523082 (2003-07-01), None
patent: 0128257 (1998-08-01), None
patent: 2001-0055249 (2001-07-01), None
patent: 2003-0029027 (2003-11-01), None
Ikeda Osamu
Ohkoda Toshiyuki
Clark Jasmine
Morrison & Foerster / LLP
Sanyo Electric Co,. Ltd.
LandOfFree
Semiconductor device and manufacturing method of the same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device and manufacturing method of the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and manufacturing method of the same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3670152