Semiconductor device and manufacturing method of the same

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating

Reexamination Certificate

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Details

C257S636000, C257S637000, C438S620000, C438S626000, C438S629000, C438S631000, C438S672000

Reexamination Certificate

active

06849923

ABSTRACT:
Disclosed is a semiconductor device, comprising a first wiring structure formed on a semiconductor substrate and including a first plug and a first wiring formed on the first plug, and a second wiring structure formed on the semiconductor substrate belonging to the wiring layer equal to the first wiring structure and including a second plug and a second wiring formed on the second plug, wherein the upper surface of the first wiring is positioned higher than the upper surface of the second wiring, and the lower surface of the first wiring is positioned flush with or lower than the upper surface of the second wiring. The present invention also provides a method of manufacturing the particular semiconductor device.

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Copy of Korean Office Action dated Feb. 28, 2002 and copy of English-language translation thereof.

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