Semiconductor device and manufacturing method for the same

Details Semiconductor device and manufacturing method for the same Semiconductor device and manufacturing method for the same

2006-08-08

2006-08-08

Blum, David S. (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Reexamination Certificate

active

07087455

ABSTRACT:
A semiconductor device and a manufacturing method for the same are provided wherein the reliability of connections of fine metal wires connecting a second semiconductor chip to a wiring board can be improved in the case wherein the second semiconductor chip, which is located above the lower, first semiconductor chip, is significantly larger than the first semiconductor chip in a configuration wherein two semiconductor chips are stacked and mounted on a wiring board. In this semiconductor device the rear surface of the first semiconductor chip and the rear surface of the second semiconductor chip are adhered to each other by means of adhesive and the side of the adhesive is inclined from the edge portions of the first semiconductor chip toward the portions of the second semiconductor chip extending from the side of the first semiconductor chip. Therefore, it becomes possible to prevent the occurrence of microcracks in the second semiconductor chip and to prevent the occurrence of defective fine metal wire connections caused by the impact at the time of electrical connection of the second semiconductor chip to the wiring board.

REFERENCES:
patent: 6353263 (2002-03-01), Dotta et al.
patent: 6503776 (2003-01-01), Pai et al.
patent: 2000299431 (2000-10-01), None
patent: 98220 (1997-01-01), None
patent: 11204720 (1999-07-01), None
patent: 2002/368190 (2002-12-01), None
Japanese Office Action dated Jan. 11, 2006 with English translation.

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