Semiconductor device and manufacturing method for the same

Details Semiconductor device and manufacturing method for the same Semiconductor device and manufacturing method for the same

2005-11-29

2005-11-29

Le, Thao P. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S778000, C438S106000, C438S108000

Reexamination Certificate

active

06969913

ABSTRACT:
There is here disclosed a semiconductor device comprising a first base material which is provided at least one semiconductor device mounted on one main surface, a plurality of first connection portions provided on the main surface and being electrically connected to the semiconductor device, and a plurality of second connection portions provided outside a region on which the semiconductor device is mounted on the main surface, and a second base material which is disposed facing other main surface of the first base material on a side opposite to the side on which the semiconductor device is mounted, bonded to an edge of the first base material, and provided a plurality of third connection portions provided outside a region on which the first base material is mounted on and being electrically connected to at least one of the second connection portions.

REFERENCES:
patent: 5528458 (1996-06-01), Yasuho et al.
patent: 5661086 (1997-08-01), Nakashima et al.
patent: 6011694 (2000-01-01), Hirakawa
patent: 6870249 (2005-03-01), Egawa
patent: 07-115112 (1995-05-01), None
patent: 08-070024 (1996-03-01), None
patent: 09-129673 (1997-05-01), None

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