Semiconductor device and manufacturing method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Details

C257S331000, C257S333000, C257S334000, C257S341000, C257S362000

Reexamination Certificate

active

07977739

ABSTRACT:
Generally, a power MOSFET mainly includes an active region occupying most of an internal region (a region where a gate electrode made of polysilicon or the like is integrated), and a surrounding gate contact region (where the gate electrode made of polysilicon or the like is derived outside a source metal covered region to make contact with a gate metal) (see FIG.65in a comparative example). Since the gate electrode made of polysilicon or the like has a stepped portion existing between both regions, a focus margin may be reduced in a lithography step, including exposure or the like, for formation of a contact hole for a source or for a gate. The invention of the present application provides a semiconductor device having a trench gate type power MISFET with a gate electrode protruding from an upper surface of a semiconductor substrate, in which respective main upper surfaces of the gate electrode in an active region and a gate contact region are substantially at the same height.

REFERENCES:
patent: 6706604 (2004-03-01), Inagawa et al.
patent: 2006/0157779 (2006-07-01), Kachi et al.
patent: 2008/0035990 (2008-02-01), Matsuura et al.
patent: 2000-223705 (2000-08-01), None
patent: 2000-277531 (2000-10-01), None
patent: 2004-055659 (2004-02-01), None
patent: 2006-202931 (2006-08-01), None
patent: 2008-042056 (2008-02-01), None

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