Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure
Reexamination Certificate
2011-07-19
2011-07-19
Graybill, David E (Department: 2894)
Active solid-state devices (e.g., transistors, solid-state diode
Test or calibration structure
Reexamination Certificate
active
07982217
ABSTRACT:
A second semiconductor chip including the operation of receiving operation instructions given from a first semiconductor chip and outputting a signal corresponding to it is mounted on mounting means. Internal wirings for interconnecting the first and second semiconductor chips, and external terminals respectively connected to the internal wirings are provided in the mounting means to constitute a multi chip module. Further, a signal path for selectively invalidating operation instructions from the first semiconductor chip to the second semiconductor chip is provided inside the module.
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Ishiguro Tetsuo
Sugita Norihiko
Yashiki Naoki
A. Marquez, Esq. Juan Carlos
Graybill David E
Renesas Electronics Corporation
Stites & Harbison PLLC
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