Semiconductor device manufacturing: process – Semiconductor substrate dicing – With attachment to temporary support or carrier
Reexamination Certificate
2007-09-04
2007-09-04
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
With attachment to temporary support or carrier
C257SE21484
Reexamination Certificate
active
10503972
ABSTRACT:
To improve the reliability and yield of a thin-type semiconductor device as used for a stack-type flash memory, the semiconductor device is manufactured by upheaving each of semiconductor chips (semiconductor devices) obtained by dicing a semiconductor wafer on an adhesive sheet from a backside via the adhesive sheet using an upthrow jig to which ultrasonic vibration is applied so as not to break through the adhesive sheet, and by picking up each semiconductor chip.
REFERENCES:
patent: 6585471 (2003-07-01), Odajima et al.
patent: 01-157549 (1989-06-01), None
patent: 02-230754 (1990-09-01), None
patent: 3-011649 (1991-01-01), None
patent: 4-177860 (1992-06-01), None
patent: 5-003242 (1993-01-01), None
patent: 5-109869 (1993-04-01), None
patent: 6-295930 (1994-10-01), None
patent: 7-106363 (1995-04-01), None
patent: 2000-091403 (2000-03-01), None
Honma Hiroshi
Mita Toru
Miyazaki Chuichi
Odashima Hitoshi
Ooroku Noriyuki
Geyer Scott B.
Renesas Technology Corp.
Ullah Elias
LandOfFree
Semiconductor device and its manufacturing method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device and its manufacturing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and its manufacturing method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3755747