Semiconductor device and its manufacturing method

Details Semiconductor device and its manufacturing method Semiconductor device and its manufacturing method

2007-09-04

2007-09-04

Geyer, Scott B. (Department: 2812)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

With attachment to temporary support or carrier

C257SE21484

Reexamination Certificate

active

10503972

ABSTRACT:
To improve the reliability and yield of a thin-type semiconductor device as used for a stack-type flash memory, the semiconductor device is manufactured by upheaving each of semiconductor chips (semiconductor devices) obtained by dicing a semiconductor wafer on an adhesive sheet from a backside via the adhesive sheet using an upthrow jig to which ultrasonic vibration is applied so as not to break through the adhesive sheet, and by picking up each semiconductor chip.

REFERENCES:
patent: 6585471 (2003-07-01), Odajima et al.
patent: 01-157549 (1989-06-01), None
patent: 02-230754 (1990-09-01), None
patent: 3-011649 (1991-01-01), None
patent: 4-177860 (1992-06-01), None
patent: 5-003242 (1993-01-01), None
patent: 5-109869 (1993-04-01), None
patent: 6-295930 (1994-10-01), None
patent: 7-106363 (1995-04-01), None
patent: 2000-091403 (2000-03-01), None

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