Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2005-02-01
2005-02-01
Clark, Jasmine (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S257000, C257S666000, C257S723000, C257S787000
Reexamination Certificate
active
06849952
ABSTRACT:
A non-lead type, stacked-type semiconductor device includes a sealing body of insulative resin, a tab, leads, each having one surface exposed on a mounting surface of the sealing body, a first semiconductor chip located in the sealing body having a first circuit-forming surface and a second surface supported on the tab through adhesive, electrode pads formed in the periphery of the first surface, conductive wires for electrically connecting the electrode pads and the leads, a second semiconductor chip having a first circuit-forming surface and a second surface opposite to the first surface, and stacked and mounted on the first surface of the first semiconductor chip toward the second surface thereof, electrode pads formed on the first surface of the second semiconductor chip, and conductive wires for electrically connecting the electrode pads of the second semiconductor chip and the leads.
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Asari Naohito
Ishimura Hiroki
Sakamoto Mitsuru
Takahashi Katsunori
Antonelli Terry Stout & Kraus LLP
Clark Jasmine
Renesas Northern Japan Semiconductor, Inc.
Renesas Technology Corp.
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