Semiconductor device and interposer

Details Semiconductor device and interposer Semiconductor device and interposer

2004-04-15

2008-03-11

Tran, Thien F (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Test or calibration structure

Reexamination Certificate

active

07342248

ABSTRACT:
A semiconductor device characterized in that connection pads for wire bonding are arranged at peripheral regions of an electrode terminal formation surface of a semiconductor chip, test pads for testing the semiconductor chip are arranged in an inside region surrounded by said peripheral regions of said electrode terminal formation surface, and a plurality of rewiring patterns extend from the peripheral regions to said inside region of said electrode terminal formation surface and the individual rewiring patterns connect the individual electrode terminals and the corresponding connection pads and test pads.

REFERENCES:
patent: 6534853 (2003-03-01), Liu et al.
patent: 2005/0030055 (2005-02-01), Tran et al.
patent: 2005/0173790 (2005-08-01), Akram
patent: 5-102254 (1993-04-01), None
patent: 7-122603 (1995-05-01), None
patent: 2002-151644 (2002-05-01), None
patent: 2003-84042 (2003-03-01), None

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