Semiconductor device and heat sink used therein

Details Semiconductor device and heat sink used therein Semiconductor device and heat sink used therein

1997-06-30

1999-07-27

Arroyo, Teresa M.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With heat sink means

257707, 257796, H01L 2328, H01L 2310, H01L 23495

Patent

active

059295139

ABSTRACT:
The present invention relates to a semiconductor device in which inner leads of a lead frame are electrically connected to a semiconductor chip, a method for producing thereof and a lead frame used therein. The object of the present invention is to improve a strength of the lead frame and a heat release efficiency in a small-size multi-pin type semiconductor device. In the inner lead of the lead frame, a thin plate portion is formed. The thin plate portions are secured on a heat spreader. A semiconductor chip is mounted on the heat spreader. The semiconductor chip is bonded to the thin plate portions of the inner leads through wires.

REFERENCES:
patent: 4204317 (1980-05-01), Winn
patent: 5227662 (1993-07-01), Ottno et al.

Affiliated with

Also associated with

Rating

Semiconductor device and heat sink used therein does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and heat sink used therein, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and heat sink used therein will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-881959