Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2003-09-24
2008-12-16
Andújar, Leonardo (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S684000, C257S782000, C257S701000
Reexamination Certificate
active
07466030
ABSTRACT:
The semiconductor device uses an insulating resin that contains at least a resin anti-repellent for adjusting wettability of the insulating resin. The insulating resin is applied on a circuit board, and a semiconductor element is placed thereon and pressed against it. The applied pressure pushes out a portion of the insulating resin under the semiconductor element. This portion of the insulating resin combines with a portion of the insulating resin around the semiconductor element to form a resin fillet on the side surfaces of the semiconductor element.
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Korean Office Action mailed Sep. 21, 2005 (w/English translation thereof).
KR 2002-0063513 dated Aug. 3, 2002 (U.S. counterpart US 2002/0142167 listed above).
Andújar Leonardo
Nixon & Vanderhye P.C.
Sharp Kabushiki Kaisha
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