Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent
1997-10-31
1999-07-06
Williams, Alexander Oscar
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
On insulating carrier other than a printed circuit board
257666, 257676, 257673, H01L 23495, H01L 2348, H01L 2328, G09G 336
Patent
active
059201150
ABSTRACT:
To provide a semiconductor device in which a thin resin film is provided on the whole margin of the principal plane of a semiconductor chip a lead is provided on the thin resin film, the lead is electrically connected with input and output electrode pads of the semiconductor chip, and the electrical joint is covered and sealed with a seal resin.
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VLSI Packaging Art, vol. 1, May 31, 1993, issued by Nikkei Business Publichations, Inc., pp. 139-141,267-274, with English translations.
Akimoto Koji
Fujioka Takahiro
Kanamitsu Shinya
Kimura Makoto
Mouri Hiroyuki
Hitachi , Ltd.
Hitachi Device Engineering Corp.
Williams Alexander Oscar
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