Semiconductor device and contractor for inspection

Details Semiconductor device and contractor for inspection Semiconductor device and contractor for inspection

2005-04-05

2005-04-05

Pham, Long (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S723000, C257S704000

Reexamination Certificate

active

06876073

ABSTRACT:
A semiconductor device superior in heat dissipation in which the exchanging of chips can be readily performed is realized by mounting, through means distinct from bonding or connecting, a LSI chip on an interconnection substrate having substantially no difference in thermal conductivity between the LSI chip and the substrate. The semiconductor device is provided on an interconnection substrate6with electrode terminals7of cantilever structure, an interconnection layer8for electrical connection among the electrode terminals7, an interconnection layer12for electrical connection to outer portions, and fitting portions9formed in a cover5, the substrate6and the cover5being connected by the fitting portions. The chips1and2are electrically contacted through the terminals7without using any bonding or connecting, so that the mounting and detachment of the cover5and the substrate can be readily performed.

REFERENCES:
patent: 5103557 (1992-04-01), Leedy
patent: 5123828 (1992-06-01), Surface
patent: 5172050 (1992-12-01), Swapp
patent: 5317196 (1994-05-01), Wong
patent: 5353498 (1994-10-01), Fillion et al.
patent: 5513072 (1996-04-01), Imaji et al.
patent: 5701666 (1997-12-01), DeHaven
patent: 6154366 (2000-11-01), Ma et al.
patent: 6157084 (2000-12-01), Hino et al.
patent: 10270496 (1998-10-01), None
patent: 11-97471 (1999-04-01), None

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