Semiconductor device and chip-stack semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With electrical contact in hole in semiconductor

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S698000, C257S784000

Reexamination Certificate

active

11455722

ABSTRACT:
A semiconductor device has multiple power-supply through electrodes, grounding through electrodes, and signal-routing through electrodes made through a semiconductor chip. The power-supply through electrodes, the grounding through electrodes, and the signal-routing through electrodes differ mutually in cross-sectional area. Hence, a semiconductor device and a chip-stack semiconductor device are provided which are capable of preventing the electrodes' resistance from developing excessive voltage drop, heat, delay, and loss, and also from varying from one electrode to the other.

REFERENCES:
patent: 5132878 (1992-07-01), Carey
patent: 5165166 (1992-11-01), Carey
patent: 5229647 (1993-07-01), Gnadinger
patent: 5426072 (1995-06-01), Finnila
patent: 5438166 (1995-08-01), Carey et al.
patent: 6184060 (2001-02-01), Siniaguine
patent: 6222276 (2001-04-01), Bertin et al.
patent: 6534879 (2003-03-01), Terui
patent: 6661086 (2003-12-01), Zelsacher
patent: 6809421 (2004-10-01), Hayasaka et al.
patent: 2004/0014311 (2005-01-01), Hayasaka et al.
patent: 64-053440 (1989-03-01), None
patent: 06-181389 (1994-06-01), None
patent: 08-008355 (1996-01-01), None
patent: 10-223833 (1998-08-01), None
patent: 2000-031329 (2000-01-01), None
patent: 2001-044357 (2001-02-01), None
patent: 2001-060654 (2001-03-01), None
patent: 3186941 (2001-05-01), None
patent: 2001-250912 (2001-09-01), None
patent: 2002-237468 (2002-08-01), None
U.S. Appl. No. 10/670,244, filed Sep. 26, 2003.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device and chip-stack semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and chip-stack semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and chip-stack semiconductor device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3892692

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.