Semiconductor device and chip-stack semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With electrical contact in hole in semiconductor

Reexamination Certificate

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C257S698000, C257S784000

Reexamination Certificate

active

07115972

ABSTRACT:
A semiconductor device has multiple power-supply through electrodes, grounding through electrodes, and signal-routing through electrodes made through a semiconductor chip. The power-supply through electrodes, the grounding through electrodes, and the signal-routing through electrodes differ mutually in cross-sectional area. Hence, a semiconductor device and a chip-stack semiconductor device are provided which are capable of preventing the electrodes' resistance from developing excessive voltage drop, heat, delay, and loss, and also from varying from one electrode to the other.

REFERENCES:
patent: 5229647 (1993-07-01), Gnadinger
patent: 6184060 (2001-02-01), Siniaguine
patent: 6534879 (2003-03-01), Terui
patent: 10-223833 (1998-08-01), None
patent: 3186941 (2001-05-01), None

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