Semiconductor device and BGA package

Details Semiconductor device and BGA package Semiconductor device and BGA package

1994-12-23

1996-08-06

Limanek, Robert P.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257707, 257730, 257738, 257706, 257723, 257704, H01L 2302, H01L 2312

Patent

active

055436633

ABSTRACT:
A first thermal conductive member and a plurality of second thermal conductive members are formed on one major surface of an insulating board. A TCP is mounted on the first thermal conductive member. A heat sink is mounted on the plurality of second thermal conductive members. A third thermal conductive member is formed on the other major surface of the insulating board. A plurality of through holes are formed in the insulating board between the first and third thermal conductive members and between the second and third thermal conductive members. Fourth thermal conductive members are formed in the plurality of through holes. Heat generated by the semiconductor chip of the TCP is conducted to the heat sink through the first to fourth thermal conductive members. Therefore, a semiconductor device with excellent heat dissipation without damaging a semiconductor element can be provided.

REFERENCES:
patent: 4922324 (1990-05-01), Sudo
patent: 5006922 (1991-04-01), McShane et al.
patent: 5018004 (1991-05-01), Okinaga et al.
patent: 5367193 (1994-11-01), Malladi
patent: 5438216 (1995-08-01), Juskey et al.

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