Semiconductor device and a wire bonding method

Details Semiconductor device and a wire bonding method Semiconductor device and a wire bonding method

2004-06-28

2008-12-02

Stoner, Kiley (Department: 1793)

Metal fusion bonding

Process

Plural joints

Reexamination Certificate

active

07458498

ABSTRACT:
A wire bonding method that connects a first bonding point and a second bonding point by a wire, the method including a step that press-bonds a ball formed on a tip end of a wire to a first bonding point, thus forming a press-bonded ball; a step that slightly raises a capillary, moves the capillary toward a second bonding point and then lowers the capillary by an amount that is smaller than an amount in which the capillary was raised, and a step that raises the capillary to allow the wire to be paid out of the capillary and moves the capillary toward a second bonding point, thus connecting the wire to the second bonding point.

REFERENCES:
patent: 5967401 (1999-10-01), Nishiura et al.
patent: 6343733 (2002-02-01), Nishiura et al.
patent: 7014095 (2006-03-01), Mochida
patent: 2005/0072833 (2005-04-01), Wong et al.
patent: 2005/0202621 (2005-09-01), Wong et al.
patent: 10-189641 (1998-07-01), None

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