Semiconductor device and a method of manufacturing the same

Details Semiconductor device and a method of manufacturing the same Semiconductor device and a method of manufacturing the same

2005-05-24

2005-05-24

Nhu, David (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

Reexamination Certificate

active

06897097

ABSTRACT:
The semiconductor device comprises: a tub for supporting a semiconductor chip; a sealing body formed by sealing the semiconductor chip with a resin; a plurality of leads made of a copper alloy, exposed to the back face of the sealing body, and having a soldered layer on the exposed mounted face; and wires for connecting the pads of the semiconductor chip and the corresponding leads. In the manufacture method, the sealing body is polished, after resin-molded, at its back face with a brush to form the two widthwise edge portions, as exposed from the back face of the sealing body, of the lead into rounded faces, and the mounted face of the lead including the rounded faces is protruded at its central portion from the back face of the sealing body thereby to improve the connection reliability at the packaging time.

REFERENCES:
patent: 5026669 (1991-06-01), Shinohara
patent: 5327104 (1994-07-01), Kikushima
patent: 5731231 (1998-03-01), Miyajima
patent: 5973395 (1999-10-01), Suzuki et al.
patent: 6208020 (2001-03-01), Minamio et al.
patent: 6399423 (2002-06-01), Matsuura et al.
patent: 2-240940 (1990-09-01), None
patent: 11-195743 (1999-07-01), None
“Semiconductor Assembling/Testing Technique of '99”, Extra Issue of Monthly Semiconductor World, Jul. 27, 1998.

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