Semiconductor device and a method of manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S532000, C257SE27081, C257SE21645, C257SE21008, C257SE29343, C438S239000, C438S396000

Reexamination Certificate

active

07968924

ABSTRACT:
In a semiconductor device comprising a capacitive element, an area of the capacitive element is reduced without impairing performance, and further, without addition of an extra step in a manufacturing process. A first capacitor is formed between an active region of a semiconductor substrate provided through a first capacitive insulating film and a lower electrode comprised of a conductor film in the same layer as a select gate electrode of a select, a second capacitor is formed between the lower electrode, and an upper electrode comprised of a conductor film in the same layer as a memory gate electrode of a memory, provided through the second capacitive insulating film in the same layer as the insulating films of a multi-layer structure, including a charge storage layer, and a stacking-type capacitive element is comprised of the first capacitor and the second capacitor, wherein a planar shape of the lower electrode is a grid-like shape having a plurality of lengths of linear conductor films each having a first width, formed along a first direction with a first interval provided therebetween, and a plurality of lengths of linear conductor films each having a second width, formed along a second direction (the direction intersecting the first direction) with a second interval provided therebetween.

REFERENCES:
patent: 5656556 (1997-08-01), Yang
patent: 7018890 (2006-03-01), Tamura
patent: 7371631 (2008-05-01), Sakai et al.
patent: 2001/0054736 (2001-12-01), Ishige
patent: 2003/0053334 (2003-03-01), Chen
patent: 2006/0003508 (2006-01-01), Sakai et al.
patent: 2007/0117340 (2007-05-01), Steltenpohl
patent: 2007/0187739 (2007-08-01), Liu et al.
patent: 2003-60042 (2003-02-01), None
patent: 2003-204003 (2003-07-01), None
patent: 2006-019373 (2006-01-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device and a method of manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and a method of manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and a method of manufacturing the same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2745940

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.