Semiconductor device and a method of manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Heterojunction device – With lattice constant mismatch

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S285000, C257SE29246, C257SE21403, C257SE27099

Reexamination Certificate

active

08004010

ABSTRACT:
In a semiconductor device with a shared contact, a gate electrode is formed via a gate insulating film on a semiconductor substrate and a sidewall insulating film is formed on both side faces of the gate electrode. At least one of the surface parts of the semiconductor substrate adjacent to both sides of the gate electrode is removed beyond the lower part of the sidewall insulating film and to the underside of the gate electrode. Then, the gate insulating film exposed in the remove part is removed. An impurity-doped semiconductor layer is formed in the part where the semiconductor substrate and the gate insulating film have been removed.

REFERENCES:
patent: 4177096 (1979-12-01), Okumura et al.
patent: 5621232 (1997-04-01), Ohno
patent: 2005/0242399 (2005-11-01), Huang
patent: 2006/0231826 (2006-10-01), Kohyama
patent: 2003-109969 (2003-04-01), None
patent: 2004-273972 (2004-09-01), None
patent: 2005-158898 (2005-06-01), None
patent: 2005-197575 (2008-07-01), None
M. Kanda, et al., “Highly Stagle 65nm Node (CMOS5) 0.56μm2SRAM Cell Design for Very Low Operation Voltage,” 2003 Symposium on VLSI Technology Digest of Technical Papers, pp. 13-14.
H. Nii, et al., “A 45nm High Performance Bulk Logic Platform Technology (CMOS6) using Ultra High NA(1.07) Immersion Lithography with Hybrid Dual-Damascene Structure and Porous Low-k BEOL”, 2006 IEDM Technical Digest, pp. 685-688.
Notice of Reasons for Rejection, issued by Japanese Patent Office, dated Mar. 29, 2011, in a Japanese patent application No. 2007-042394 (3 pages), and English translation thereof.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device and a method of manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and a method of manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and a method of manufacturing the same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2732950

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.