Semiconductor device and a method of manufacturing the same

Details Semiconductor device and a method of manufacturing the same Semiconductor device and a method of manufacturing the same

2004-11-10

2008-12-23

Thai, Luan (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S127000, C438S112000, C257S778000

Reexamination Certificate

active

07468294

ABSTRACT:
A semiconductor device comprising semiconductor chips each formed with plural pads at the main surface, chip parts each formed with connection terminals at both ends thereof, a module substrate on which the semiconductor chips and the chip parts are mounted, solder connection portions for connecting the chip parts and the substrate terminals of the module substrate by soldering, gold wires for connecting the pads of the semiconductor chips and corresponding substrate terminals of the module substrate, and a sealing portion formed with a low elasticity resin such as an insulative silicone resin or a low elasticity epoxy resin for covering the semiconductor chips, chip parts, solder connection portions and gold wires which prevents flow out of the solder in the solder connection portion by re-melting thereby preventing short-circuit.

REFERENCES:
patent: 4785533 (1988-11-01), Seino et al.
patent: 5989993 (1999-11-01), Zakel et al.
patent: 6195260 (2001-02-01), Moriyama
patent: 6329065 (2001-12-01), Ishida et al.
patent: 11-238962 (1999-08-01), None
patent: 2000-223623 (2000-08-01), None
Wolf et al., Silicon Processing For the VLSI Era, Lattice Press, vol. 1, pp. 851-859.

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