Semiconductor device and a method for manufacturing the same

Active solid-state devices (e.g. – transistors – solid-state diode – Including region containing crystal damage

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257510, 257513, 257519, 257520, 257618, 257622, 257415, 257418, H01L 2930

Patent

active

056751761

ABSTRACT:
A semiconductor device has a semiconductor substrate having a groove, and a semiconductor element formed in a surface region of the semiconductor substrate. A substance having a thermal expansion coefficient different from the semiconductor substrate is embedded in at least a portion of the groove, a crystal defect is generated from the region near the bottom of the groove in the semiconductor substrate, thereby alleviating stress and strain in other regions of the semiconductor substrate, such that such regions cannot generate crystal defects in a region necessary for a circuit operation of the semiconductor element of the surface region.

REFERENCES:
Fahey et al., "Stress-induced dislocations in silicon integrated circuits" IBM J. Res Develop., vol. 36, No. 2, Mar. 1992, pp. 158-182 Mar. 3, 1992.
S. Matsuda et al., "Three-Dimensional Mechanical Stress Analysis of Trench Isolation along {111} Gliding Planes." Technical Digest of International Electron Devices Meeting, 1994. Jan.

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