Semiconductor device and a manufacturing method thereof

Details Semiconductor device and a manufacturing method thereof Semiconductor device and a manufacturing method thereof

2011-08-23

2011-08-23

Loke, Steven (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

C257S676000

Reexamination Certificate

active

08004096

ABSTRACT:
A semiconductor device and a manufacturing method of the device are disclosed. The semiconductor device includes a substrate that mounts a semiconductor element, a first stiffener, a reinforcement resin member, and a second stiffener for reinforcing the reinforcement resin member.

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patent: 7061085 (2006-06-01), Moxham
patent: 7728440 (2010-06-01), Honda
patent: 2004/0150118 (2004-08-01), Honda
patent: 2005/0161816 (2005-07-01), Kanda
patent: 2010/0230797 (2010-09-01), Honda
patent: 2000-133741 (2000-05-01), None
patent: 2004-260138 (2004-09-01), None
patent: 2004/086498 (2004-10-01), None
Japanese Office Action mailed Oct. 12, 2010 in corresponding Japanese Patent Application 2006-045625.

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