Semiconductor device and a manufacturing method of the same

Details Semiconductor device and a manufacturing method of the same Semiconductor device and a manufacturing method of the same

2011-07-19

2011-07-19

Smith, Matthew (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S109000, C257SE21509, C257SE21705

Reexamination Certificate

active

07981788

ABSTRACT:
The degree of freedom of the chip layout in a semiconductor device is improved, and improvement in packaging density is aimed at.Since it becomes possible to form the wire of two directions on the pad of a memory chip by performing the over-bonding of reverse bonding by ball bonding, an effect equivalent to continuation stitch bonding of wedge bonding can be produced by ball bonding. Hereby, the degree of freedom of a chip layout and the degree of freedom of the lead layout of substrate3can be improved, and the packaging density on a substrate in a chip lamination type semiconductor device (memory card) can be improved.

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