Semiconductor device manufacturing: process – With measuring or testing – Electrical characteristic sensed
Reexamination Certificate
2008-05-27
2010-10-19
Nguyen, Thanh (Department: 2893)
Semiconductor device manufacturing: process
With measuring or testing
Electrical characteristic sensed
C438S018000, C438S014000, C438S106000, C257SE21531
Reexamination Certificate
active
07816154
ABSTRACT:
A semiconductor device for SiP or PoP for downsizing, a method of manufacturing it, and a testing method suitable for SiP and PoP in which the simplification of a system and the enhancement of its efficiency are achieved are provided. A first semiconductor device including a first memory circuit determined as non-defective and a second semiconductor device including a second memory circuit and a signal processing circuit carrying out signal processing according to a program, determined as non-defective are sorted. The sorted devices are assembled as an integral semiconductor device. On a board for testing, a clock signal equivalent to the actual operation of the semiconductor device is supplied. A test program for conducting a performance test on the first memory circuit is written from a tester to the second memory circuit of the second semiconductor device. In the signal processing circuit, a performance test is conducted on the first memory circuit according to the written test program in correspondence with the clock signal. The result of failure
o-failure determination in this performance test is outputted to the tester.
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Hamada Kanya
Nakajima Yoshiaki
Seito Akira
Tanaka Tasuke
Miles & Stockbridge P.C.
Nguyen Thanh
Renesas Electronics Corporation
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