Semiconductor device, a method for making the same, and an...

Details Semiconductor device, a method for making the same, and an... Semiconductor device, a method for making the same, and an...

2005-03-15

2005-03-15

Eckert, George (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

C257S773000, C257S780000, C257S781000, C257S782000, C257S778000, C438S119000

Reexamination Certificate

active

06867505

ABSTRACT:
A semiconductor device, comprising an electrode on a base surface, a bump formed on the electrode, a pad, and a means of connection. The means of connection comprises a plurality of conductive particles, conducting the bump and the pad with conductive particles bonded between. The base surface is further formed with a barrier rib that separates the conductive particles.

REFERENCES:
patent: 5650919 (1997-07-01), Loh et al.
patent: 5804882 (1998-09-01), Tsukagoshi et al.
patent: 5844314 (1998-12-01), Kim
patent: 5903056 (1999-05-01), Canning et al.

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