Semiconductor device

Details Semiconductor device Semiconductor device

1996-09-05

1998-01-13

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

257737, 257738, 257780, 257692, 257784, H01L 2348, H01L 2352, H01L 2940

Patent

active

057083045

ABSTRACT:
A semiconductor device is reduced in size and has a highly warp resistant structure. A sealing resin formed by transfer molding covers a whole semiconductor chip including pad electrodes, connecting bumps, an upper surface of a wiring board including a plurality of chip connecting patterns, a side surface of the wiring board, and a peripheral area of a lower surface of the wiring board surrounding an area where external electrode portions are located. The wiring board is substantially coextensive in an area with the semiconductor chip in plan configuration. The area occupied by the external electrode portions is smaller than the area occupied by the chip connecting patterns.

REFERENCES:
patent: 4641176 (1987-02-01), Keryhuel et al.
patent: 4691225 (1987-09-01), Murakami et al.
patent: 5399903 (1995-03-01), Rostoker et al.
patent: 5440169 (1995-08-01), Tomita et al.
patent: 5461197 (1995-10-01), Hiruta et al.
patent: 5535101 (1996-07-01), Miles et al.
patent: 5557150 (1996-09-01), Variot et al.
patent: 5565709 (1996-10-01), Fukushima et al.

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