Semiconductor device

Details Semiconductor device Semiconductor device

2011-08-09

2011-08-09

Malsawma, Lex (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

C257S794000, C257SE23118

Reexamination Certificate

active

07994646

ABSTRACT:
A semiconductor device is disclosed. One aspect provides a semiconductor device that includes a semiconductor chip including a first face and a second face opposite the first face, an encapsulant including inorganic particles encapsulating the semiconductor chip, a first metal layer attached to the first face of the semiconductor chip, a second metal layer attached the second face of the semiconductor chip, and electrically conducting material configured to connect the first metal layer with the second metal layer.

REFERENCES:
patent: 4816299 (1989-03-01), Alpha et al.
patent: 7790576 (2010-09-01), Bathan et al.
patent: 2001/0016400 (2001-08-01), Lee
patent: 2006/0197190 (2006-09-01), Doan
patent: 2007/0236859 (2007-10-01), Borland et al.
patent: 10158307 (2003-02-01), None

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