Semiconductor device

Details Semiconductor device Semiconductor device

2011-03-15

2011-03-15

Monbleau, Davienne (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With specified encapsulant

C257SE23117

Reexamination Certificate

active

07906859

ABSTRACT:
A semiconductor device includes a molding resin layer and a semiconductor element encapsulated with the molding resin layer. The molding resin layer has an opening. A surface of the semiconductor element is partially exposed outside the molding resin layer through the opening. A groove is located in the surface of the semiconductor element around the opening of the molding resin layer. The groove is filled with the molding resin layer to produce anchor effect that enhances adhesive force of the molding resin layer to the surface of the semiconductor element around the opening.

REFERENCES:
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patent: 7230309 (2007-06-01), Bauer et al.
patent: 2009/0046183 (2009-02-01), Nishida et al.
patent: 2009/0053850 (2009-02-01), Nishida et al.
patent: A-04-142751 (1992-05-01), None
patent: A-05-136298 (1993-06-01), None
patent: A-05-183072 (1993-07-01), None
patent: A-06-085132 (1994-03-01), None
patent: A-08-031989 (1996-02-01), None
patent: A-09-289269 (1997-11-01), None
patent: A-2005-203431 (2005-07-01), None
Office Action mailed Jul. 21, 2009 from Japan Patent Office in the corresponding Japanese Patent Application No. 2007-215977 (and English translation).

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