Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Reexamination Certificate
2011-05-24
2011-05-24
Chu, Chris (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
C257SE23151, C257S775000, C257S776000, C438S612000, C438S666000
Reexamination Certificate
active
07948094
ABSTRACT:
The semiconductor device according to the present invention includes a semiconductor layer, an interlayer dielectric film formed on the semiconductor layer, a wire formed on the interlayer dielectric film with a metallic material to have a width of not more than 0.4 μm, and a broad portion integrally formed on the wire to extend from the wire in the width direction thereof.
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Kageyama Satoshi
Nakao Yuichi
Chu Chris
Rabin & Berdo PC
Rohm & Co., Ltd.
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