Semiconductor device

Details Semiconductor device Semiconductor device

2011-05-17

2011-05-17

Warren, Matthew E (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Transmission line lead

C257S736000, C257S781000, C257SE23012, C257SE23039, C257SE23144

Reexamination Certificate

active

07944026

ABSTRACT:
A semiconductor device is mounted on a package substrate which has a power supply line and a signal line formed of a normal or predetermined resistance material layer on a dielectric layer. A resistance material layer has a high resistance as compared with the normal resistance material layer and is additionally provided on the surface of the normal resistance material layer of the peripheral face of the signal line closest to the power supply line.

REFERENCES:
patent: 9-186509 (1997-07-01), None
patent: 2006-13553 (2006-01-01), None
patent: 2006013553 (2006-01-01), None
Machine Translation of JP 2006-13553 A. The Original Japanese reference is not being furnished with this Office Action since the original reference was supplied by the applicant in an IDS.
Japanese Patent Office issued a Japanese Office Action on Oct. 22, 2008, Application No. 2006-345590.

Affiliated with

Also associated with

Rating

Semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2682062