Semiconductor device

Details Semiconductor device Semiconductor device

2011-06-07

2011-06-07

Nguyen, Thinh T (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S734000, C257S723000, C365S051000, C365S063000

Reexamination Certificate

active

07956470

ABSTRACT:
A semiconductor device has a semiconductor chip which is usable as any one of 4-bit, 8-bit, and 16-bit structure devices, and a package for packaging the semiconductor chip. The semiconductor chip has first and second DQ pad groups of DQ system pads for said 16-bit structure device. The first DQ pad group is arranged in a first area at a vicinity of a middle part of a surface of the semiconductor chip while the second DQ pad group is arranged in a second area at an outer side of the first area on the surface. An additional pad necessary as one of DQ system pads for the 8-bit structure device except for pads included in the second DQ pad group is formed in the second area.

REFERENCES:
patent: 6538331 (2003-03-01), Masuda et al.
patent: 6995320 (2006-02-01), Kusakabe et al.
patent: 7161865 (2007-01-01), Fujisawa
patent: 7215561 (2007-05-01), Park et al.
patent: 2004 348950 (2004-12-01), None

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