Semiconductor device

Details Semiconductor device Semiconductor device

1996-12-29

1998-07-28

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257712, 257720, 257703, 257706, 438465, H01L 2334, H01L 2310, H01L 2306

Patent

active

057866341

ABSTRACT:
A semiconductor device includes a semiconductor substrate having first and second main surfaces; a function element layer having heating element portions generating heat during operation, disposed on the first main surface that is thinned; and a plated heat sink of a heat conductive material, having a thickness equal to or greater than that of the semiconductor substrate, disposed on a circumferential region of the second main surface at the perimeter of the semiconductor substrate inward, on main heat generating regions of the second main surface including regions opposite the heating element portions, and on supporting regions of the second main surface connecting the circumferential region to the main heat generating regions. The semiconductor device maintains the heat generating function and the handling performance of the plated heat sink, reduces internal stress during plating and repeated stress produced by heat cycles during fabricating processes, and lessens chip breakage and plating peeling.

REFERENCES:
patent: 3896479 (1975-07-01), Di Lorenzo et al.
patent: 5144413 (1992-09-01), Adlerstein
patent: 5338967 (1994-08-01), Kosaki
patent: 5457072 (1995-10-01), Tamaki et al.

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