Semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Reexamination Certificate

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Details

C257S723000, C257S784000, C257SE23032, C257SE23033, C257SE23044, C257SE25015, C257SE25025, C361S734000

Reexamination Certificate

active

07948078

ABSTRACT:
A semiconductor device has a package structure provided with leads that are external connection terminals. A base substance is an island, and at least the surface thereof is formed of a conductive material. A semiconductor substrate is mounted on the surface of the base substance, and a ground potential is supplied from the surface of the base substance. A shunt capacitor is provided with an electrode pair of a first electrode and a second electrode formed in parallel, and mounted with the first electrode being electrically connected to the surface of the base substance. An internal bonding wire connects a pad provided on the semiconductor substrate for external connection, to the second electrode of the shunt capacitor. The lead is the external connection terminal of the semiconductor device. An external bonding wire connects the lead to the second electrode of the shunt capacitor.

REFERENCES:
patent: 4042952 (1977-08-01), Kraybill
patent: 4168507 (1979-09-01), Yester, Jr.
patent: 5103283 (1992-04-01), Hite
patent: 5635751 (1997-06-01), Ikeda et al.
patent: 6022759 (2000-02-01), Seki et al.
patent: 6340839 (2002-01-01), Hirasawa et al.
patent: 2002-231875 (2002-08-01), None
Chinese Office Action for Chinese Application No. 200510007933.4 issued May 12, 2010 with English translation.
Chinese Office Action for Chinese Application No. CN 20071013734.8 issued Nov. 29, 2010 with English translation.

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