Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Utility Patent
1998-12-15
2001-01-02
Hardy, David (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S685000, C257S686000, C257S723000, C257S724000, C257S778000
Utility Patent
active
06169325
ABSTRACT:
BACKGROUND OF THE INVENTION
The present invention relates to a semiconductor device and an electronic apparatus and, more particularly, to a low-profile mass-storage electronic apparatus in which tape carrier packages (TCPs) with a memory chip encapsulated are mounted on a wiring board in high density.
For high-density mounting of semiconductor-chip-encapsulated packages on a wiring board, a method has been proposed in which these packages are arranged in a tilted relation to the mounting surface of the wiring board.
For example, Japanese Published Unexamined Patent Application Nos. Hei 7(1995)-321441 and Hei 8(1996)-191127 disclose mounting structures in which the lead extended from one side of a resin-encapsulated package is bent in a slanting direction to mount the package on the wiring board in a tilted relation to the mounting surface thereof and the package is supported by a supporting member extended from another side of the package to prevent-the same from falling down.
Further, Japanese Published Unexamined Patent Application No. Hei 4(1992)-65135 discloses a mounting structure in which a lead extended from one end of a tape carrier package is bent to a given angle to mount the tape carrier package in a vertical or tilted relation to the mounting surface of the wiring board.
SUMMARY OF THE INVENTION
However, in many of the conventional tilt-mount structures, each package is tilted at an angle of 45 degrees or more relative to the mounting surface of the wiring board, so that, when packages are mounted on both sides of the mounting board, the thickness thereof increases, making it difficult to be applied to a low-profile electronic apparatus strictly restricted in height dimensions such as a memory module and a memory card.
It is therefore an object of the present invention to provide a low-profile electronic apparatus in which chip packages are mounted on both sides of a wiring board with high density and the thickness (or height) of the wiring board is held small.
The foregoing and other objects and novel features of the invention will be apparent from the description herein and attached drawing.
The following briefly describes representative ones of the inventions to be disclosed by the present application.
(1) In a semiconductor device of this invention, a plurality of tape carrier packages are mounted on at least one surface of a wiring board, each of the plurality of tape carrier packages is mounted on the wiring board with a tilt through a support lead for regulating an angle of the tilt relative to a mounting surface of the wiring board.
(2) In the semiconductor device of (1), the plurality of tape carrier packages mounted along a direction in which a plurality of leads extended from each of the plurality of tape carrier packages are mounted so that the plurality of tape carrier packages alternate inside the mounting surface of the wiring board.
(3) In the semiconductor device of (1), the plurality of tape carrier packages mounted on the front surface of the wiring board and the plurality of tape carrier packages mounted on the rear side of the wiring board at positions opposite to those of the plurality of tape carrier packages mounted on the front surface are mounted such that a plurality of leads extended from the tape carrier packages mounted on the front side are opposite to those of the plurality of tape carrier packages mounted on the rear side.
(4) In the semiconductor device of (1), a portion of each of the plurality of tape carrier packages gets under the adjacent tape carrier package.
(5) In the semiconductor device of (1), each of the plurality of tape carrier packages is pivotally mounted at a joint between the wiring board and the plurality of leads.
(6) In the semiconductor device of (1), each of the plurality of leads extended from each of the plurality of tape carrier packages is formed halfway with a bent.
(7) In the semiconductor device of (1), each of the plurality of tape carrier packages is mounted such that the tilt angle is not more than 45 degrees relative to the mounting surface of the wiring board.
(8) In the semiconductor device of (1), the rear surface of a semiconductor chip encapsulated in each of the plurality of tape carrier packages is exposed.
(9) In the semiconductor device of (1), an empty area of the wiring board is mounted with en electronic part other than the plurality of tape carrier packages.
(10) In an electronic apparatus of this invention, the wiring board and the plurality of tape carrier packages of (1) mounted on at least one surface of the wiring board are accommodated in a case.
(11) In the electronic apparatus of (10) the case is formed at a portion thereof with an opening for heat dissipation.
(12) In the electronic apparatus of (10), a spacer about as high as the mounting height of the plurality of tape carrier packages is inserted in a gap between the plurality of tape carrier packages mounted on the wiring board.
(13) The electronic apparatus according to the invention is a memory module.
(14) The electronic apparatus according to the invention is a memory card.
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Azuma Shuichiro
Emata Takashi
Kudaishi Tomoaki
Masuda Masachika
Nishi Kunihiko
Cruz Lourdes
Hardy David
Hitachi , Ltd.
Mattingly Stanger & Malur, P.C.
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