Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Patent
1997-12-12
2000-10-10
Saadat, Mahshid
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
257784, 257202, 257203, H01L 2348, H01L 2352, H01L 2940
Patent
active
061304840
ABSTRACT:
A semiconductor device includes a buffer region having buffers and disposed along a side of a semiconductor chip; a pad region having pads corresponding to the buffers and disposed outside the buffer region on the semiconductor chip; signal lines connecting the buffers to corresponding pads; and power supply lines and ground lines connected to extra pads, either of the power supply lines or the ground lines being partially superimposed on part of and separated from the signal lines by insulating layers.
REFERENCES:
patent: 5206529 (1993-04-01), Mine
patent: 5300795 (1994-04-01), Shintani
Goi Yoichi
Kameda Hideo
Taniguchi Hideki
Ueda Naoto
Clark Jhihan B.
Mitsubishi Denki & Kabushiki Kaisha
Saadat Mahshid
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