Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Small lead frame for connecting a large lead frame to a...
Patent
1993-07-27
1994-12-06
James, Andrew J.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
Small lead frame for connecting a large lead frame to a...
257666, 257675, 257687, 257787, H01L 2348, H01L 2946, H01L 2962, H01L 2964
Patent
active
053714067
ABSTRACT:
According to this invention, there is provided a semiconductor device including a TAB tape having through hole for an element, a plurality of leads integrally formed on the TAB tape, a semiconductor element connected to one end of each of the leads through a bump formed in the through hole for the element, a plurality of lead frames each connected to the other end of a corresponding one of the leads, and a mold resin sealed to cover the most part of the TAB tape, the leads, the semiconductor element, and the lead frames, wherein connection portions between the leads and the lead frames are linearly formed at equal pitches perpendicularly to an outer periphery of the semiconductor element opposite to the connection portions. Each of portions near positions where the leads are respectively connected to the lead frames is formed in a gull-wing shape. The straight end portions of the lead frames extend from ends of the lead frames to flexing points of the lead frames, and the lengths of the straight end portions are set at least 0.3 mm or more. In the mold resin, the thickness of a resin positioned at the upper portion of the semiconductor element is set to be smaller than that of a resin positioned at the lower portion of the semiconductor element.
REFERENCES:
patent: 3902148 (1975-08-01), Drees et al.
patent: 4951120 (1990-08-01), Hagiwara et al.
patent: 5065504 (1991-01-01), Olla
patent: 5191403 (1993-03-01), Nakazawa
patent: 5210440 (1993-05-01), Long
IEEE Transactions of Components, Hybrids & Manufacturing Technology, vol. CHMT-10, No. 3, Sep. 1987, Steven T. Holzinger, et al., "Advantages of a Floating Annular Ring in Three-Layer Tab Assembly", pp. 332-334.
Feinwerktechnik & Messtechnik, vol. 100, No. 11, Nov. 1992, A Modl, pp. 506-510, "Die Verarbeitung von Fine-Pitch--Bauteilen mit Tape Automated Bonding (TAB)".
Hirata Seiichi
Kojima Shinjiro
Clark S. V.
James Andrew J.
Kabushiki Kaisha Toshiba
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