Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Patent
1995-06-02
1998-04-21
Monin, Donald
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
257787, 257692, H01L 2348, H01L 2946, H01L 2302
Patent
active
057421013
ABSTRACT:
A semiconductor device is provided in connection with a semiconductor chip which has a plurality of bonding pads at a part corresponding to a centrally located area of the front or first main surface thereof, an organic insulator film which overlies the semiconductor chip and which has an opening in correspondence with the bonding pads, a plurality of leads which overly the organic insulator film, and a molding resin with which these constituents are sealed or packaged.
REFERENCES:
patent: 4575748 (1986-03-01), Terai, et al.
patent: 4612564 (1986-09-01), Moyer
patent: 4630095 (1986-12-01), Otsuka, et al.
patent: 4796078 (1989-01-01), Phelps, Jr. et al.
patent: 4862245 (1989-08-01), Pashby et al.
patent: 4934820 (1990-06-01), Takahashi et al.
ISSCC '86, pp. 260-261 and 365; pp. 274-275 and 371 (Digest of Technical Papers).
Kaneda Aizo
Mitani Masao
Miyazawa Kazuyuki
Murakami Gen
Nakamura Shozo
Hitachi , Ltd.
Monin Donald
LandOfFree
Semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2060722