Semiconductor device

Details Semiconductor device Semiconductor device

1999-10-12

2000-10-31

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Smart card package

257723, 257724, H01L 2302

Patent

active

06140697&

ABSTRACT:
Condenser (114), coil (115) and thin-thickness integrated circuit (312) are placed between the upper cover sheet (117) and the lower cover sheet (118), and adhesive (119) is filled into the space among them, whereby a card is fabricated. Because condenser (114), coil (115) and thin-thickness integrated circuit (312) are extremely thin, the resulting semiconductor device is strong to bending and highly reliable at a low cost.

REFERENCES:
patent: 4962415 (1990-10-01), Yamamoto et al.
patent: 5598032 (1997-01-01), Fidalgo
patent: 5719437 (1998-02-01), Clifton et al.
patent: 5909050 (1999-01-01), Furey et al.
patent: 5969951 (1999-10-01), Fischer et al.
patent: 5986341 (1999-11-01), Usami et al.
patent: 5996897 (1999-12-01), Prancz

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