Semiconductor device

Details Semiconductor device Semiconductor device

1999-01-05

2000-11-28

Clark, Sheila V.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257659, 257667, 257787, H01C 23495

Patent

active

061539236

ABSTRACT:
A semiconductor device according to the invention of the present application includes a semiconductor chip having a plurality of electrodes provided on the surface thereof, at least one inner lead fixed to the surface of the semiconductor chip with an insulating layer interposed therebetween, a shielding plate placed in the neighborhood of a first side of the semiconductor chip, and a sealing resin for sealing the semiconductor chip, the inner lead and the shielding plate. The sealing resin is injected from the direction of a second side of the semiconductor chip, which is opposite to the first side of the semiconductor chip Therefore, the flow of the resin is controlled upon sealing so that the resin is uniformly injected.

REFERENCES:
patent: 5371044 (1994-12-01), Yoshida et al.
patent: 5684327 (1997-11-01), Nakazawa et al.
patent: 5926695 (1999-07-01), Chu et al.
patent: 5932923 (1999-08-01), Kim et al.

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