1983-11-22
1985-12-24
James, Andrew J.
357 73, 357 71, H01L 21283, H01L 2354, H01L 2308
Patent
active
045610096
ABSTRACT:
A semiconductor device is disclosed which includes a semiconductor substrate; a metal wiring layer comprising an Al alloy formed on the surface of this substrate; and an alumina layer covering this metal layer and containing at least one metal selected from the group consisting of Cu, Mg, Ni, Cr, Mn, Ti and Y. A method for manufacturing such a semiconductor device is also disclosed.
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Aoyama Masaharu
Yonezawa Toshio
Clark Sheila V.
James Andrew J.
Tokyo Shibaura Denki Kabushiki Kaisha
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