Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Patent
1998-10-06
1999-11-09
Picardat, Kevin M.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Encapsulating
438124, 438126, H01L 2144
Patent
active
059813156
ABSTRACT:
As the semiconductor chip is large-sized, highly integrated and speeded up, it becomes difficult to pack the semiconductor chip together with leads in a package. In view of this difficulty, there has been adopted the package structure called the "Lead-On-Chip" or "Chip-On-Lead" structure in which the semiconductor and the leads are stacked and packed. In the package of this structure, according to the present invention, the gap between the leading end portions of the inner leads and the semiconductor chip is made wider than that between the inner lead portions except the leading end portions and the semiconductor chip thereby to reduce the stray capacity, to improve the signal transmission rate and to reduce the electrical noises.
REFERENCES:
patent: 3783348 (1974-01-01), Swartz et al.
patent: 4203792 (1980-05-01), Thompson
patent: 4209355 (1980-06-01), Burns
patent: 4355463 (1982-10-01), Burns
patent: 4577214 (1986-03-01), Schaper
patent: 4637130 (1987-01-01), Fujii et al.
patent: 4661837 (1987-04-01), Sono
patent: 4684975 (1987-08-01), Takiar et al.
patent: 4796078 (1989-01-01), Phelps, Jr. et al.
patent: 4809053 (1989-02-01), Kuraishi
patent: 4862245 (1989-08-01), Pashby et al.
patent: 4951122 (1990-08-01), Tsubosaki et al.
patent: 4996587 (1991-02-01), Hinrischsmeyer et al.
patent: 5049981 (1991-09-01), Dehringer
patent: 5072780 (1991-12-01), Matsukwia
patent: 5198883 (1993-03-01), Takahashi et al.
patent: 5357139 (1994-10-01), Yaguchi et al.
patent: 5530286 (1996-06-01), Murakami et al.
patent: 5612569 (1997-03-01), Murakami et al.
patent: 5656551 (1997-08-01), Corbett et al.
Anjoh Ichiro
Eguchi Syuuji
Hasebe Akio
Hozoji Hiroshi
Ichitani Masahiro
Hitachi , Ltd.
Picardat Kevin M.
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