Semiconductor device

Details Semiconductor device Semiconductor device

1989-12-08

1990-07-24

Hille, Rolf

357 68, H01L 2348, H01L 2350, H01L 2312

Patent

active

049438433

ABSTRACT:
According to the present invention, as improvement in the adhesion of inner leads with a packaging resin in a resin-sealed semiconductor device is attained by spreading leads on or near the circuit-forming face of a pellet, or on or near the main non-circuit-forming face of the pellet to extend the lengths of the inner leads on or under the pellet.

REFERENCES:
patent: 3444440 (1969-05-01), Bell et al.
patent: 3708730 (1973-01-01), Shierz et al.
patent: 4048438 (1977-09-01), Zimmerman
patent: 4246595 (1981-01-01), Noyori et al.
patent: 4595945 (1986-06-01), Graver
patent: 4612564 (1986-09-01), Moyer

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