Semiconductor device

Details Semiconductor device Semiconductor device

1995-11-02

1996-10-15

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

257793, 257788, H01L 2328, H01L 2329

Patent

active

055657095

ABSTRACT:
A semiconductor device comprising a semiconductor element encapsulated with a cured resin having at least two secondary differential peaks of linear thermal expansion by a thermomechanical analytical measurement, the interval between the peaks being at least 20.degree. C. The semiconductor device encapsulated with the cured resin does not cause a warp and is excellent in the TCT test characteristics and the cracking resistance.

REFERENCES:
patent: 5107327 (1992-04-01), Nishimori et al.
patent: 5218030 (1993-01-01), Katayose et al.

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