Semiconductor device

Details Semiconductor device Semiconductor device

1994-10-27

1996-05-07

Monin, Jr., Donald L.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257692, 257783, 257786, H01L 2348, H01L 2946

Patent

active

055149057

ABSTRACT:
A semiconductor device is provided in connection with a semiconductor chip which has a plurality of bonding pads at a part corresponding to a centrally located area of the front or first main surface thereof, an organic insulator film which overlies the semiconductor chip and which has an opening in correspondence with the bonding pads, a plurality of leads which overly the organic insulator film, and a molding resin with which these constituents are sealed or packaged.

REFERENCES:
patent: 4575748 (1986-03-01), Terai et al.
patent: 4612564 (1986-09-01), Moyer
patent: 4630095 (1986-12-01), Otsuka et al.
patent: 4796078 (1989-01-01), Phelps, Jr. et al.
patent: 4862245 (1989-08-01), Pashby et al.
patent: 4934820 (1990-06-01), Takahashi et al.
ISSCC '86, pp. 260-261 and 365; pp. 274-275 and 371 (Digest of Technical Papers).

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