Semiconductor device

Details Semiconductor device Semiconductor device

1993-07-16

1995-05-02

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

29883, H01L 2302

Patent

active

054121574

ABSTRACT:
A semiconductor device includes a molded resin encapsulating a semiconductor chip, outer leads extending from the molded resin and having free ends, and a resin layer connecting and supporting the outer leads along the entire length of the outer leads. The resin layer may have an activating ability for soldering. A method for manufacturing a semiconductor device includes preparing a semiconductor device having a molded resin and a plurality of outer lead portions extending from the molded resin and connected to a lead frame, forming a resin film on and between the outer lead portions; cutting the lead portions to provide cantilevered outer leads having free ends; lead-forming the outer leads with lead-forming dies while heating the resin film to form a resin layer connecting and supporting the outer leads along the entire lengths of the outer leads, and taking the semiconductor device out of the lead-forming dies after the resin layer has been cured.

REFERENCES:
patent: 4801561 (1989-01-01), Sankhagowit
patent: 4849857 (1989-07-01), Butt et al.
patent: 4874722 (1989-10-01), Bednarz et al.
patent: 4914741 (1990-04-01), Brown et al.
patent: 5075760 (1991-12-01), Nakashima et al.
patent: 5152057 (1992-10-01), Murphy

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