Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent
1991-11-04
1993-06-15
LaRoche, Eugene R.
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
On insulating carrier other than a printed circuit board
257676, 257787, H01L 2348, H01L 2328
Patent
active
052201961
ABSTRACT:
A semiconductor device includes an insulating substrate; a semiconductor chip on which plural electrodes including at least one ground electrode and at least one power source electrode are disposed; plural leads supported by an obverse surface of the insulating substrate, the plural leads being connected to corresponding electrodes on the semiconductor chip; at least one grounding conductor plate on a reverse surface of the insulating substrate; and at least one power source conductor plate on the reverse surface of the insulating substrate. This semiconductor device includes grounding contact holes for electrically connecting the grounding conductor plate to a ground lead coupled to the ground electrode on the semiconductor chip; power source contact holes for electrically connecting the power source conductor plate to a power source lead coupled to the power source electrode on the semiconductor chip; and a package body encapsulating the semiconductor chip and an end of each of the leads so that the other end of each of the leads is exposed outside the package body.
REFERENCES:
patent: 4801999 (1989-01-01), Hayward et al.
patent: 4903113 (1990-02-01), Frankeny et al.
patent: 4949158 (1990-08-01), Ueda
patent: 5036380 (1991-07-01), Chase
patent: 5049974 (1991-09-01), Nelson et al.
patent: 5067005 (1991-11-01), Michii et al.
Michii Kazunari
Shimamoto Haruo
Takehara Masataka
LaRoche Eugene R.
Mitsubishi Denki & Kabushiki Kaisha
Nguyen Viet Q.
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